拾取与放置:碳纳米管纳米组装工艺
Pick and Place: Carbon Nanotube Nanoassembly Process

原始链接: https://www.c12qe.com/news/pick-and-place-carbon-nanotube-quantum-chip-manufacturing

C12 公司宣布推出“拾取与放置”(Pick & Place)技术。这是一种专利纳米组装工艺,能够将单个碳纳米管精确、可扩展地集成到量子芯片上。通过将纳米管生长与芯片制造过程解耦,C12 现在可以在组装前预选并电学筛选单个纳米管的质量。这一创新直接解决了量子比特变异性这一关键挑战,确保了更高的器件一致性和性能。 这项新工艺标志着制造技术的重大飞跃。C12 最近证明了这一突破,仅用四周时间就组装了 50 个器件,而过去完成此项任务需要整整一年。产量的提升支持了复杂高密度芯片的开发,例如 C12 的 17 器件“高清芯片”(HD chip),该芯片证实了多纳米管集成的可重复性。 受先进半导体封装技术的启发,“拾取与放置”工艺为实现 C12 的 2026 年技术路线图提供了必要的基础设施。通过将这种确定性组装与此前在纠错和软件集成方面取得的里程碑相结合,C12 已成功建立起可扩展的制造流程,为其在 2033 年前迈向拥有超过 10 万个物理量子比特的实用级量子处理器奠定了基础。

Hacker News 最新 | 过往 | 评论 | 提问 | 展示 | 招聘 | 提交 登录 拾取与放置:碳纳米管纳米组装工艺 (c12qe.com) 7 分,由 bpierre 于 1 小时前发布 | 隐藏 | 过往 | 收藏 | 1 条评论 帮助 GoatOfAplomb 8 分钟前 [-] > 在芯片上放置一个(纳米管)就像在巴黎大小的表面上放置一根头发,精度要求在几条街道之内。 老实说,这听起来很容易。 回复 准则 | 常见问题 | 列表 | API | 安全 | 法律 | 申请 YC | 联系 搜索:
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原文

C12 today announces Pick & Place, a patented nanoassembly process to transfer individual carbon nanotubes onto quantum chips with micrometric precision.

Pick & Place is a core building block of how C12 envisions the scalable manufacturing of carbon nanotube quantum processors. A carbon nanotube is 100,000 times thinner than a human hair. Placing one on a chip is like placing a hair on a surface the size of Paris, accurate to within a few streets. By introducing an intermediate assembly step that decouples nanotube growth from chip fabrication, the process brings significantly more flexibility and modularity to C12's fabrication flow, while addressing one of the hardest challenges in quantum hardware manufacturing: qubit variability.

The process allows C12 to preselect and qualify individual carbon nanotubes before integration, enabling much tighter process control and guaranteeing the quality of the assembled devices. C12 is currently the only company capable of doing this through electrical prescreening at the qubit level.

The throughput numbers illustrate the step change in process maturity. With the process now streamlined and partially automated, C12 assembled 50 devices in the last four weeks. The same number took the entire year of 2025 to assemble using the previous method.

A step change in manufacturing throughput

This new manufacturing approach also enables the scaling integration of multi-qubit structures. C12's High-Density chip integrates 17 quantum devices on a single chip, breaking the ceiling of low CNT count chips, now only limited by the current density of devices on the chip. First announced by Pierre Desjardins at the Q2B conference in San Francisco, the HD chip serves as a proof point that precise multi-nanotube integration is both achievable and repeatable, while C12 continues to perfect its high-performance single and two-qubit building blocks.

"Pick & Place is directly inspired by techniques used in advanced semiconductor packaging, where the same concept enables very high throughput integration. We adapted it to the nanoscale to achieve deterministic assembly of carbon nanotubes, opening the same long-term opportunity for quantum chip manufacturing," said Matthieu Desjardins, co-founder, chairman, and CTO of C12.

Beyond the technical milestone, the technology adds a significant new layer to C12's IP portfolio alongside existing patents in qubit control, carbon nanotube growth, and quantum device architecture.

Building the infrastructure for the roadmap

The announcement follows C12's technology roadmap, published in April 2026, which targets four processor generations from Aïdôs (2027) to Panopeia (2033), scaling from a first logical qubit to over 100,000 physical qubits at utility scale. Reproducible manufacturing is one of the core challenges the roadmap must solve. Pick & Place is C12's answer, built and running today.

This milestone completes a broader sequence of progress: material foundations validated through a Nature Communications publication, error correction tooling secured through a partnership with QC Design, and hardware connected to the enterprise software ecosystem through an integration with Classiq. The manufacturing infrastructure to execute the roadmap is now in place.

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